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US Patent Issued




US Patent and Trademark Office Issued a US patent to Terence Chan

US Patent No. 6,466,898

October 20, 2002

US Patent and Trademark Office has issued a US patent 6,466,898 to Terence Chan, CEO and President of Dynetix Design Solutions

The patent covers advanced multithreaded HDL simulation technologies on industrial standard symmetrical multiprocessor (SMP) platforms. Furthermore, the patent covers advanced techniques in mixed HDL languages simulation, cross-platform remote simulation, and cross-platform simulation jobs scheduling. According to Terence Chan, the patent helps Dynetix Design Solutions maintains its technical leadership in the digital and mixed-signal IC verification market, and validates the unique technologies that have been implemented in the V2SimTM product.


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Dynetix Design Solutions
3268 Ridgefield Way, Dublin, CA 94568 USA
Tel: 925-833-7851
Internet: info@dynetix.com





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